Abstract

We report the hybrid flip-chip integration of III-V laser on a monolithic silicon photonics (SiPh) platform. Wafer-scale laser attach was demonstrated with the assistance of a laser cavity on a Si substrate. The attach process was accomplished through precise optical and mechanical alignment features on the laser and SiPh wafer. Efficient laser-to-photonic integrated circuit (PIC) butt-coupling with optical power up to 11 dBm was achieved through a combination of precise mechanical stops and optical alignment features. Key laser performance metrics such as mode hopping and relative intensity noise (RIN) vs. reflectivity were also studied. The impact of laser-PIC alignment on the coupling efficiency was studied through comprehensive two-dimensional (2D) and three-dimensional (3D) numerical modeling. Simulations were also performed to explore different coupler designs for optimized laser coupling performance.

Date

June 1, 2021

Authors

Yusheng Bian, Koushik Ramachandran, Bo Peng, Brittany Hedrick, Scott Mills, Keith Donegan, Monica Esopi, Takako Hirokawa, Ajey Jacob, Vaishnavi Karra, Firat Yasar, Benjamin Fasano, Asli Sahin, Thomas Houghton, Karen Nummy, Armand Rundquist, Ed Vail, Hanyi Ding, Kevin Dezfulian, Zhuojie Wu, Daniel Fisher, Jim Pape, Jay Steffes, Louis Medina, Subharup Gupta Roy, Harry Cox, Bart Green, Jorge Lubguban, Asif Chowdhury, Won Suk Lee, Abdelsalam Aboketaf, Michal Rakowski, Kate McLean, Zoey Sowinski, Oh-Jung Kwou, Gabrielle Robert, Massimo Sorbara, Subramanian Krishnamurthy, Andy Stricker, Jae Kyu Cho, Ian Melville, Dave Riggs, Rod Augur, Norman Robson, Daniel Berger, Luke Lee, Vikas Gupta, Anthony Yu, Ken Giewont, Ted Letavic, John Pellerin

Conference

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Pages

237-244

Publisher

IEEE