Publications

Folded ballistic conductor interconnect line

Abstract

A method includes forming a folding template in a first dielectric layer. The folding template has a plurality of surfaces that are positioned in different planes. A ballistic conductor line is formed on the plurality of surfaces of the folding template. A device includes a first dielectric layer and a vertically folded line disposed in the first dielectric layer, the vertically folded line including a ballistic conductor material.

Date
April 25, 2017
Authors
AP Jacob
Inventors
Ajey Poovannummoottil Jacob
Patent_office
US
Patent_number
9633947
Application_number
14608337